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HCB719-EDLR-P4S Series

The HCB719 - EDLR - P4S series bearings use ceramic balls as rolling elements. The ceramic material has the characteristics of low density, high hardness, and a low coefficient of thermal expansion. This enables the bearing to have small centrifugal force and inertial force during high-speed operation, easily breaking through higher rotational speed limits. At the same time, it reduces dimensional changes caused by thermal expansion and contraction, maintaining high precision.

HCB719-EDLR-P4S Series
HCB719-EDLR-P4S Series
  Type Main dimensions Rated load Rated speed
      Dynamics Static Speed limit
Mail   d[mm] D[mm] B[mm] C[kN] C0[kN] [r/min]
HCB71913-EDLR-T-P4S 65 90 13 - - -
HCB71912-EDLR-T-P4S 60 85 13 - - -
HCB71911-EDLR-T-P4S 55 80 13 - - -
HCB71910-EDLR-T-P4S 50 72 12 - - -
HCB71909-EDLR-T-P4S 45 68 12 - - -
HCB71908-EDLR-T-P4S 40 62 12 - - -
HCB71907-EDLR-T-P4S 35 55 10 - - -
HCB71906-EDLR-T-P4S 30 47 9 - - -
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Dentail
  • Structural Characteristics
    • Precision Ceramic Rolling Elements: The HCB719 - EDLR - P4S series bearings use ceramic balls as rolling elements. The ceramic material has the characteristics of low density, high hardness, and a low coefficient of thermal expansion. This enables the bearing to have small centrifugal force and inertial force during high-speed operation, easily breaking through higher rotational speed limits. At the same time, it reduces dimensional changes caused by thermal expansion and contraction, maintaining high precision.
    • Optimized Angular Contact Design: The contact angle is precisely adjusted, generally between 20° and 30°, balancing excellent axial and radial load-bearing capacities. When bearing axial thrust, the force is evenly distributed to the rings along the contact angle. Combined with the smooth rolling of the ceramic balls, it effectively reduces local stress concentration and ensures the structural stability of the bearing.
    • High-precision Ring Process: The rings are made of high-quality bearing steel through multiple fine forging, heat treatment, and ultra-precision grinding processes. The surface roughness reaches the nanometer level, ensuring smooth contact with the ceramic balls, minimizing friction loss, and achieving excellent rotational accuracy.
  • Performance Advantages
    • Ultra-high Precision: Reaching the P4S precision grade, it has excellent dimensional accuracy and rotational accuracy. The dimensional tolerances are strictly controlled under static conditions, and the radial runout and axial play during dynamic operation are extremely small, providing precise support for precision machining, inspection, etc.
    • Ultimate High-speed Performance: With the help of ceramic balls and the optimized structure, it can operate stably at ultra-high rotational speeds, suppressing vibration and noise, and reducing fatigue damage during high-speed operation, meeting the strict requirements for high-speed bearings in fields such as aerospace and high-end manufacturing.
    • Strong Adaptability and Reliability: It has strong adaptability to changes in temperature, humidity, and load. Whether it is in the high-temperature environment of an aircraft engine, the high-humidity environment of marine equipment, or the machine tool spindle under complex forces, it can work stably, reducing maintenance costs.
Application
The bearings can be used in the following industries
  • Aerospace: In the main shafts of aircraft engines, the rotating components of aircraft navigation systems, etc., high precision, high rotational speed, and high-temperature resistance are required for bearings. This series of bearings ensures flight safety and the precise operation of equipment with its excellent performance.
  • High-end Machine Tools: High-precision CNC machining centers and the spindles of grinding machines rely on it to achieve the high-speed and precise rotation of tools, and to machine parts that meet the strict standards of high-end manufacturing industries such as aerospace and automotive.
  • Semiconductor Manufacturing: It drives the precise positioning and movement of silicon wafers in lithography machines and etching machines, ensuring the nanometer-level precision of chip manufacturing, helping to improve the yield rate of chips and promoting the progress of semiconductor technology.
  • Precision Instruments: For example, the rotating shafts of optical measuring instruments and electron microscopes maintain the high resolution and measurement accuracy of the instruments with their high precision, expanding the boundaries of scientific research and testing.
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